4 GB memory module (DIMM) is now possible Samsung new Stacking technology for DRAM
The new technology boasts of providing next generation packaging solutions that will make it possible to make high density and smaller size memory modules.
(Click on Read more to expand)
About this innovative technology:
advanced WSP technology for the first time.
“The innovative TSV-based MCP (multi-chip package) stacking technology offers a next-generation packaging solution that will accommodate the ever-growing demand for smaller-sized, high-speed, high-density memory,” said Tae-Gyeong Chung, vice president, Interconnect Technology Development Team, Memory Division, Samsung Electronics. “In addition, the performance advancements achieved by our WSP technology can be utilized in many diverse combinations of semiconductor packaging, such as system-in-package solutions that combine logic with memory.”
Via Press release
New innovative technologies:
Welcome to Techlivez.com , If you're new here, you may want to subscribe our RSS feed for irresistible updates. You can also get these posts by email -Subscribe via Email Today- Thanks for visiting!




Latest News Here!
Latest News | http://google.com/group/tremendous-latest-news/web/